Xiaomi is gearing up for the launch of the Xiaomi Mix Flip 2 in China. The tech giant has disclosed the timeline for releasing its new clamshell foldable smartphone, confirming that it will feature Xiaomi’s HyperOS interface and a rear camera system developed in collaboration with Leica. The device is anticipated to be powered by the Snapdragon 8 Elite chipset and will boast a 6.85-inch inner display. This new model serves as a successor to the original Xiaomi Mix Flip released last year.
On its official website, Xiaomi has initiated promotional activities for the Xiaomi Mix Flip 2, showcasing a banner that includes the tagline “see you this month.” This suggests that the handset will officially launch in the coming weeks. The teaser underscores the expected camera system jointly engineered with Leica.
While the promotional materials do not provide specific design details of the Mix Flip 2, they do confirm its use of the HyperOS interface. Xiaomi has also begun accepting pre-reservations for the smartphone on its China website.
Expected Specifications of Xiaomi Mix Flip 2
Although Xiaomi has not yet disclosed detailed specifications for the Mix Flip 2, leaked information suggests it will feature the powerful Snapdragon 8 Elite chipset. The device is expected to come equipped with a 6.85-inch 1.5K LTPO OLED inner display that supports a 120Hz refresh rate. Reports indicate that it may be slimmer and lighter than its predecessor, with an anticipated thickness of 7.6mm when unfolded and a weight around 190g.
According to previous leaks, the Xiaomi Mix Flip 2 will include a dual rear camera configuration, comprising a 50-megapixel main sensor with a 1/1.5-inch format and a 50-megapixel ultra-wide sensor at 1/2.76 inches. Additionally, it is rumored to feature a 5,100mAh battery that supports 67W wired charging. The device might also be constructed to an IPX8 rating, ensuring resistance to dust and water.
The Xiaomi Mix Flip 2 is expected to be unveiled alongside the Redmi K80 Ultra and a new tablet under the Redmi brand.
