Xiaomi introduced its first internally developed chipset, the XRING O1, on Thursday, specifically designed for the Xiaomi 15S Pro. New information about the chipset has emerged, highlighting its advanced 3nm architecture, manufactured using Taiwan Semiconductor Manufacturing Company’s (TSMC) cutting-edge N3E process technology. This same technology has been employed by major players including Apple, MediaTek, and Qualcomm for their respective 3nm processors. The XRING O1 will be available in smartphones throughout China and boasts a powerful configuration featuring a 10-core CPU, a 6-core NPU, and a 16-core GPU.
XRING O1 Features 10-Core CPU and 6-Core NPU
An insightful die shot of the XRING O1 shared by user Kurnal (@Kurnalsalts) on X (formerly known as Twitter) provides a detailed glimpse into Xiaomi’s new chipset (via Notebookcheck). According to the post, the die measures 114.7 mm² (10.8 × 10.6 mm), with the usable components occupying 109.5 mm² of space.
The First SoC by Xiaomi
Xring O1 Dieshot
Thanks By Geekerwans and 万扯淡
Layout By Kurnal
Diesize=10.8×10.6=114.48mm2
Used area=109.5xmm2 pic.twitter.com/aeSZA7yv4X— Kurnal (@Kurnalsalts) May 22, 2025
The XRING O1’s compact size is comparable to other leading flagship chipsets built on TSMC’s N3E process technology. The die shot also illustrates the arrangement of various components, including the CPU, GPU, and NPU cores.
The XRING O1 features a 10-core CPU, which includes two Arm Cortex-X925 cores clocked at 3.9GHz, six Cortex-A725 cores that can reach up to 3.4GHz, and two Cortex-A520 cores operating at 1.8GHz. It also integrates a 16-core Arm Immortalis-G925 MP16 GPU alongside a 6-core NPU, with both the CPU and NPU benefiting from a shared 16MB cache.
The die shot further indicates that the XRING O1 will support LPDDR5T RAM operating at 9,600Mbps, and it includes a sensor hub and an unspecified encryption core. Notably, there is no visible integrated modem within the chipset, suggesting that the Xiaomi 15S Pro will rely on a separate modem for connectivity.
Recent benchmark results have hinted that the XRING O1 may deliver performance levels comparable to those of Qualcomm’s flagship Snapdragon 8 Elite. It remains to be seen if Xiaomi will expand the use of the XRING O1 chipset across a broader range of smartphone models in the near future.
