According to recent reports, Samsung’s forthcoming Exynos 2600 system-on-chip (SoC) will feature a new thermal management component designed to enhance the processor’s performance. This chipset serves as the successor to the Exynos 2500 and is anticipated to be manufactured using the company’s advanced 2nm process technology. The Exynos 2600 is expected to power the upcoming Samsung Galaxy S26 smartphone series.
Samsung Electronics to Complete Exynos 2600 Testing by October
Shortly after the launch of the Exynos 2500, ZDNet Korea disclosed that Samsung has developed a new copper-based component intended for integration into the semiconductor package. The enhancements are said to boost performance for the successors to the Galaxy S25 series, which utilizes customized Snapdragon 8 Elite chips from Qualcomm.
The report states that Samsung is working on a new Heat Pass Block (HPB) designed to be included within the semiconductor package alongside the DRAM for the Exynos 2600. Testing for this chip is reportedly set to conclude by the end of October.
Positioning this material nearer to the chip promises to improve heat dissipation, potentially alleviating some overheating issues that have affected various chips in the past. Notably, the company currently utilizes package-on-package (PoP) and fan-out wafer-level packaging (FOWLP) for earlier Exynos models.
Details regarding the Exynos 2600 have surfaced previously, with the chipset recently appearing on Geekbench under the codename S5E9965. It recorded scores of 2,155 in single-core and 7,788 in multi-core tests, which are slightly below the performance metrics achieved by the Snapdragon 8 Elite, the chip used in many devices launched in 2025.
Additionally, leaked 3DMark benchmark scores suggest that the upcoming Exynos 2600 SoC’s GPU could outperform the Snapdragon 8 Elite. However, it is crucial to keep in mind that Qualcomm plans to unveil the next generation of its Snapdragon 8 Elite 2 in September, which may present a stronger challenge in the near future for Samsung’s new chipset.
