Sony has released a detailed teardown of the PlayStation 5 Pro, showcasing enhancements made to the cooling system of the console. Among these improvements are modifications to the liquid metal cooling technique used in the PS5, which are designed to provide a more consistent thermal management.
These changes come in response to unfounded speculations suggesting that the liquid metal utilized in the original PS5 could leak and potentially harm the device. Various outlets had even cautioned users against positioning their PS5 vertically after misunderstandings arose from statements made by a repair shop owner, which were incorrectly portrayed by the jailbreak site Wololo.net. Following this, Wololo issued a clarification, acknowledging that their earlier report contained a significant error, ultimately indicating that this liquid metal issue was not widespread.
In the blog post, Sony insisted on the enhancements made in the PS5 Pro’s design. Shinya Tsuchida, the Mechanical Design Lead for the PS5 Pro, noted:
“We invested considerable time in researching insulation during the development of the original PS5. While the fundamental structure remains unchanged in the PS5 Pro, we have implemented improvements such as fine grooves where the liquid metal is applied to enhance cooling stability. Our initial research for the original PS5 led us to foresee that semiconductor technology would advance significantly, making liquid metal vital. Our predictions proved correct, as it became a crucial aspect of the PS5 Pro’s design.”
The remainder of the blog post and its visuals may seem familiar to those who have viewed iFixit’s teardown of Sony’s high-end console, which indicated that the PS5 Pro’s interior features significantly more thermal management elements than actual electronics.
Included in the enhancements is a revamped cooling fan, which now features redesigned blades, among which are smaller blades interspersed throughout. The blog also addresses the visibility of the traces on the motherboard of the PS5 Pro, explaining that additional electrical layers are integrated underneath to facilitate faster memory access.
