MediaTek presented a variety of artificial intelligence (AI) solutions tailored for multiple devices and platforms at the Computex 2025 event held on Tuesday. The Taiwan-headquartered semiconductor manufacturer revealed its inaugural hybrid computing solution designed to provide AI functionality at the edge, introduced a new chipset aimed at enhancing in-car infotainment systems with AI capabilities, and rolled out an Internet-of-Things (IoT) platform to energize a diverse selection of devices. These advancements reflect MediaTek’s broader AI strategy, which focuses on delivering on-device, edge, and cloud-based AI solutions.
In a press release detailing these innovations, Joe Chen, the President and COO of MediaTek, emphasized the company’s mission to deliver AI-enhanced experiences across various applications and to foster the widespread adoption of generative AI.
Among the noteworthy innovations is a conceptual hybrid computing solution that merges 5G connectivity through MediaTek’s AI-driven Fixed Wireless Access (FWA) gateway with embedded AI capabilities in a single device. Currently in the prototype stage, the company asserts that it will offer high performance with substantial bandwidth while maintaining low latency and data privacy. MediaTek has completed proof-of-concept trials in collaboration with a “leading telecommunications infrastructure provider.”
This hybrid solution also features an AI Hub that connects to smart home devices, enabling on-device AI agents to function as personal assistants for users. Once fully developed, this technology will empower users to control multiple home appliances simultaneously via a centralized AI hub.
Furthermore, MediaTek emphasized its partnership with Nvidia in the development of the GB10 Grace Blackwell Superchip, touted as the world’s smallest AI supercomputer for the DGX Spark. The superchip is capable of executing 1,000 trillion operations per second (TOPS) and can efficiently run AI models that contain up to 200 billion parameters locally.
In this collaboration, MediaTek’s contribution includes custom application-specific integrated circuit (ASIC) solutions tailored to meet the high performance and networking requirements of contemporary datacenters and AI accelerators. The company’s future roadmap also entails advancements in process nodes, high-speed interconnects, and customized high-bandwidth memory (HBM) packaging to enhance compute density and efficiency.
MediaTek introduced its flagship Dimensity Auto Cockpit C-X1 chipset, designed to integrate AI models and acoustic technologies for creating personalized virtual assistants within in-car infotainment systems. This platform also supports advanced features such as 8K video playback, Dolby Vision HDR, and Dolby Atmos.
Additionally, the company revealed the Dimensity Auto Connect MT2739, a 5G Dual SIM Dual Active solution featuring three transmit antennas (DSDA 3Tx). This system employs AI to enhance network connectivity and includes capabilities like intelligent scene recognition. MediaTek also showcased a 5G eCall system, which can automatically notify emergency services in the event of a serious accident.
On the IoT front, MediaTek introduced its Genio 720 and 520 IoT platforms, capable of supporting a wide array of devices across home, retail, industrial, and commercial applications. The platforms are designed to cater to motorcycle control boards, robotic arms, and service robots. MediaTek is collaborating with industry players such as Advantech, ADLINK, and VIA to co-develop applications for these platforms.
Lastly, the technology leader introduced its AI-driven Filogic Wi-Fi solution that can detect sources of interference, optimize settings, and allocate bandwidth effectively across multiple devices. Additionally, the company plans to roll out its 5G-Advanced LEO NR non-terrestrial network (NTN) over the Ku-band in Taiwan.
