At Computex 2025, MediaTek revealed an array of artificial intelligence (AI) solutions designed to enhance various devices and platforms. The Taiwan-based semiconductor manufacturer introduced its inaugural hybrid computing solution facilitating AI capabilities at the edge, a new chipset aimed at improving AI functionality in in-car infotainment systems, and an Internet-of-Things (IoT) platform to support a diverse range of devices.
In a press statement, MediaTek outlined the multiple AI innovations presented at the event. Joe Chen, President and COO of MediaTek, emphasized the firm’s commitment to delivering AI-enhanced experiences across various applications, promoting the widespread adoption of generative AI technology.
The hybrid computing solution represents a conceptual design that merges 5G connectivity through MediaTek’s AI-driven Fixed Wireless Access (FWA) gateway with on-device AI features into a single platform. Currently in prototype form, MediaTek asserts that this technology will provide high performance across substantial bandwidth while maintaining low latency and safeguarding data privacy. The chipmaker has completed proof-of-concept trials in collaboration with a leading telecommunications infrastructure provider.
Through this hybrid solution, MediaTek showcased its AI Hub, which integrates with smart home devices, allowing on-device AI agents to function collaboratively as personal assistants. When fully developed, this technology will enable users to control multiple home appliances via a centralized AI hub simultaneously.
Additionally, MediaTek highlighted its collaboration with Nvidia on the GB10 Grace Blackwell Superchip, touted as the world’s smallest AI supercomputer designed for the DGX Spark. This superchip boasts the ability to execute 1,000 trillion operations per second (TOPS) and can locally process AI models with parameters reaching up to 200 billion.
MediaTek’s involvement in this initiative includes the creation of custom application-specific integrated circuit (ASIC) solutions tailored to meet the high-performance and networking requirements of contemporary data centers and AI accelerators. The company detailed its roadmap focusing on advanced process nodes, high-speed interconnects, and tailored high-bandwidth memory (HBM) packaging, aimed at enhancing compute density and efficiency.
In introducing the flagship Dimensity Auto Cockpit C-X1 chipset, MediaTek indicated that it will combine AI models with acoustic technology to foster personalized virtual assistants for in-car infotainment systems. This platform supports 8K video, Dolby Vision HDR, and Dolby Atmos sound systems.
Furthermore, MediaTek unveiled the Dimensity Auto Connect MT2739, which features an in-car 5G Dual SIM Dual Active technology equipped with three transmit antennas (DSDA 3Tx). This system intelligently utilizes AI to enhance network connectivity and includes functionalities such as intelligent scene recognition. A demonstration of a 5G eCall system was also featured, capable of automatically notifying emergency services in the event of a severe accident.
In the IoT space, MediaTek presented its Genio 720 and 520 platforms, designed to support a vast array of applications across home, retail, industrial, and commercial domains. The company indicated these solutions can cater to various devices, including motorcycle control boards, robotic arms, and service robots. MediaTek is currently collaborating with IoT companies like Advantech, ADLINK, and VIA to co-create applications for its platform.
Finally, the tech giant showcased its AI-driven Filogic Wi-Fi, which is capable of detecting interference sources, optimizing settings, and distributing bandwidth effectively across multiple devices. Plans are also underway to launch its 5G-Advanced LEO NR non-terrestrial network (NTN) over the Ku-band in Taiwan.
