At Computex 2025 on Tuesday, MediaTek introduced a series of artificial intelligence (AI) solutions designed for a variety of devices and platforms. The Taiwanese chip manufacturer presented its inaugural hybrid computing solution, which aims to provide AI capabilities at the edge, along with a new chipset specifically for in-car infotainment systems and an Internet of Things (IoT) platform to support numerous devices. These innovations align with MediaTek’s overarching vision to deliver AI solutions that operate on-device, at the edge, and in the cloud.
In a recent press release, MediaTek outlined the key AI-driven innovations displayed at Computex 2025. Joe Chen, President and COO of MediaTek, emphasized that the company seeks to create AI experiences across various applications and foster the wider integration of generative AI.
One notable innovation is a conceptual hybrid computing solution that combines 5G connectivity through MediaTek’s AI-enhanced Fixed Wireless Access (FWA) gateway with on-device AI functionality. Currently in the prototype phase, this solution is designed to provide high performance with extensive bandwidth while maintaining low latency and data privacy. MediaTek indicated it has successfully completed proof-of-concept trials with a prominent telecommunications infrastructure provider.
Through this hybrid solution, MediaTek also showcased its AI Hub, which connects to smart home devices and enables on-device AI agents to function collaboratively as personal assistants for users. When fully developed, this technology will allow individuals to manage multiple home appliances simultaneously via a centralized AI hub.
Additionally, MediaTek highlighted its collaboration with Nvidia on the GB10 Grace Blackwell Superchip, touted as the world’s smallest AI supercomputer, engineered for the DGX Spark. This superchip can achieve a performance level of 1,000 trillion operations per second (TOPS) and manage AI models with up to 200 billion parameters locally.
MediaTek’s involvement in this project includes providing custom application-specific integrated circuit (ASIC) solutions tailored to meet the high-performance and networking requirements of contemporary data centers and AI accelerators. The company’s strategy features advancements in process nodes, high-speed interconnects, and customized high-bandwidth memory (HBM) packaging, which are set to enhance compute density and efficiency.
Introducing its flagship Dimensity Auto Cockpit C-X1 chipset, MediaTek stated that it will integrate AI models with acoustic technologies to facilitate personalized virtual assistants within in-car infotainment systems. This platform is also capable of supporting 8K video, Dolby Vision HDR, and Dolby Atmos technologies.
Moreover, MediaTek revealed the Dimensity Auto Connect MT2739—a 5G Dual SIM Dual Active system featuring three transmit antennas (DSDA 3Tx). This system utilizes AI to optimize network connectivity and incorporates intelligent scene recognition. The company also demonstrated a 5G eCall system that can autonomously inform emergency services following a serious accident.
In the realm of IoT, MediaTek introduced its Genio 720 and 520 IoT platforms, which can cater to a broad array of devices across home, retail, industrial, and commercial sectors. Applications for these platforms range from motorcycle control boards to robotic arms and service robots. MediaTek is collaborating with IoT firms such as Advantech, ADLINK, and VIA to co-develop applications on this platform.
Lastly, MediaTek showcased its AI-powered Filogic Wi-Fi technology, capable of detecting sources of interference, optimizing settings, and managing bandwidth across multiple devices. The company also announced plans to launch its 5G-Advanced LEO NR non-terrestrial network (NTN) over the Ku-band in Taiwan.
