On Monday, MediaTek introduced its latest Dimensity 8400 chipset, designed specifically for mobile devices and targeted at the premium smartphone segment. This new processor features an all-big-core architecture that MediaTek claims provides a multi-core performance boost of up to 41 percent compared to its predecessor, the Dimensity 8300. Additionally, the chipset integrates artificial intelligence (AI) functionalities through a dedicated neural processing unit (NPU), optimizing it for generative AI tasks.
According to MediaTek, devices utilizing the Dimensity 8400 SoC are anticipated to hit the market by the end of 2024. Xiaomi has already indicated that its forthcoming Redmi Turbo 4 model in China will be equipped with this new chipset, with a launch expected in early 2024.
The Dimensity 8400 chipset positions itself above the Dimensity 8300 in MediaTek’s product lineup. It is equipped with eight Arm Cortex-A725 cores, capable of reaching a peak clock speed of 4.32GHz, although the cores utilize varying memory caches. The manufacturer emphasizes that the chipset not only enhances multi-core performance by 41 percent but also significantly reduces power consumption by 44 percent through precise power curve control.
Complementing the processor is the Arm Mali-G720 GPU, which achieves 24 percent higher peak performance and improves power efficiency by 42 percent over the Dimensity 8300. MediaTek has also incorporated the MediaTek Frame Rate Converter (MFRC) for improved gaming experience and MediaTek Adaptive Gaming Technology (MAGT) 3.0 for real-time performance enhancements.
Devices powered by the Dimensity 8400 chipset will support LPDDR5x RAM and UFS 4.0 storage technology.
Capitalizing on the growing trend of AI integration, the Dimensity 8400 SoC includes the MediaTek NPU 880 to facilitate generative AI capabilities. This chipset also features the new Dimensity Agentic AI Engine (DAE), which first appeared in the Dimensity 9400 chip. MediaTek asserts that this enhancement will elevate traditional AI applications to more advanced agentic capabilities, providing 21 percent faster outputs in Stable Diffusion v1.5 and 33 percent quicker text generation in the Baichuan 4B AI model compared to earlier models.
Smartphones utilizing the Dimensity 8400 can manage up to 320-megapixel camera sensors, thanks to the built-in MediaTek Imagiq 1080 ISP, which employs QPD remosaic technology for improved light capture and faster focusing. Additionally, the chipset supports 4K video recording and playback at 60 frames per second (fps) and is capable of handling displays with a maximum WQHD resolution and a 144Hz refresh rate. It also supports devices with dual-screen configurations.
In terms of connectivity, the Dimensity 8400 SoC incorporates MediaTek’s 5G-A modem, which boasts performance up to 5.17 Gbps and compatibility with Wi-Fi 6E and Bluetooth 5.4. MediaTek confirmed that the Dimensity 8400 supports multiple satellite systems, including QZSS, Galileo, Beidou, GLONASS, NavIC, and GPS. Furthermore, it features MediaTek UltraSave 3.0+ technology to enhance efficiency on 5G networks.
