The Xiaomi 16 is anticipated to be unveiled in the final quarter of this year, succeeding last year’s Xiaomi 15. In the lead-up to its release, a leaked Computer-aided design (CAD) render offers insight into the device’s aesthetic. The render reveals that the Xiaomi 16 will feature a triple rear camera setup, while maintaining a design that closely resembles its predecessor, albeit with a distinct dual-tone finish.
Maijinbu Official has shared a purported CAD render of the upcoming Xiaomi 16. The design shows similarities to the Xiaomi 15, equipped with a hole-punch display and a squircle camera module situated in the top left corner of the rear panel. The camera module is illustrated with three sensors, an LED flash, and Leica branding, while the volume buttons and power key are located on the left edge of the device.
The render suggests a dual-tone aesthetic for the Xiaomi 16, featuring slightly rounded edges and slim bezels surrounding the screen. The USB Type-C port, speaker, and SIM card tray are positioned along the bottom edge of the phone.
The Xiaomi 16 is expected to make its debut in China in September, alongside the Xiaomi 16 Pro. Both models are anticipated to be the first devices to incorporate Qualcomm’s upcoming Snapdragon 8 Elite 2 chipset, which will likely be announced at the Snapdragon Summit later this month.
Rumored specifications for the Xiaomi 16 indicate a compact design with a 6.32-inch flat display and an operating system built on the HyperOS 3 interface, based on Android 16. It is also expected to sport a 50-megapixel triple rear camera configuration.
Previous leaks suggest that the Xiaomi 16 will feature a substantial battery capacity of approximately 7,000mAh. Additionally, reports indicate that the device may utilize the latest silicon-carbon (Si/C) technology, a feature that could also extend to the Xiaomi 16 Pro.